Equipment＆Charges

Equipment name	Open Project	Classified Project
SU8000,S-5500	14,080	72,160
Titan80-300	36,080	106,480
FEI-Titan G2-cubed	46,640	121,440
FEI-Titan G2-cubed	50,160	125,860

※All charges listed here are including tax.

Microstructural Characterization (Analytical Research Core for Advanced Materials)
■Technical support charge: Open project:3,300 yen/hour Classified Project:6,600yen/hour
Equipment usage Charges【yen/day(8hours)】

Equipment name	Open Project	Classified Project
JEM-ARM200F	30,800	163,680
Topcon EM-002B	25,520	51,920
JEOL JEM-2000EXII	16,720	34,320
FIB-SEM(Quanta 3D)	30,360	62,920
FIB-SEM(Versa 3D)	30,360	62,920
JEOL EM-09100IS	17,600	32,560
PIPSII	9,680	22,880
Model1010	3,520	13,200
X-ray Diffractometer	6,160	32,560
Thermoanalysis	5,280	12,320

※ All charges listed here are including tax.

Microstructural Characterization (Research and Analytical Center for Giant Molecules)
Equipment usage Charges【yen/day(8hours)】

Equipment name	Open Project	Classified Project
Nuclear magnetic resonance (NMR)	5,200	32,100
ICP optical emission spectrometer	3,200	4,600

・Raw chemicals for syntheses are not included.
・All charges listed here are including tax.

Nanofabrication(MEMS)
【Open Project】 ■Technical support fee: 3,300 yen/hour　　 ■Facility usage charge: 960 yen/hour（790 yen/hour for the use within the Universityr ） 【Classified Project】 ■Technical support fee: 6,514 yen/hour　　 ■Facility usage charge: 960 yen/hour（790 yen/hour for the use within the Universityr ）

No.	Equipment name	Open P	Classified P	No.	Equipment name	Open P	Classified P
A.Cleaning & drying
A-1	Draft chamber	1,290	1,548	A-7	Spin-drying machine	2,428	2,914
A-2	Draft chamber for SiN etching	1,730	2,076	A-8	Organic draft chamber	1,290	1,548
A-4	Inert oven for sintering	1,710	2,052	A-9	4" spin drying machine	2,612	3,134
A-5	Vacuum oven	994	1,192	A-10	6"spin drying machine	2,612	3,134
A-6	Brush scrubber	6,906	8,286
B.Photolithography
B-2	Spin coater	2,170	2,604	B-13	Elionix EB lithography	9,422	11,306
B-3	Clean oven	2,830	3,396	B-14	Laser writer	7,094	8,512
B-4	Curing oven	1,872	2,246	B-15	Maskless exposure system for ball	4,450	5,340
B-5	Double-side aligner	3,240	3,888	B-16	Spin dryer	2,208	2,650
B-8	Draft chamber for development	1,290	1,548	B-17	Hot plate	994	1,192
B-9	UV curing	4,120	4,944	B-18	maskless aligner	5,374	6,450
B-10	Spin coater	2,332	2,798	B-19	i-line stepper	14,960	29,700
B-11	Spray developer	2,156	2,588	B-20	Coater developer	6,458	13,200
C.Oxidation/diffusion, ion injection and heat treatment
C-1	Oxidation furnace (for semiconductors)）	10,598	12,716	C-7	Annealing furnace	10,112	12,134
C-2	Oxidation furnace (for MEMS)	9,168	11,000	C-8	Medium-current ion injector	19,934	23,922
C-3	P diffusion furnace	11,562	13,874	C-10	Rapid thermal annealing	8,522	10,226
C-4	P push-in furnace	9,854	11,824	C-11	Metal diffusion furnace	7,856	9,426
C-5	B diffusion furnace	10,938	13,126
C-6	B push-in furnace	9,854	11,824
D.Deposition
D-1	LPCVD（SiN）	12,108	14,530	D-12	MOCVD	19,484	23,382
D-2	LPCVD（Poly-Si）	11,838	14,206	D-13	JPEL PECVD	15,156	18,188
D-3	LPCVD（SiO2）	12,808	15,368	D-14	TEOS PECVD	16,904	20,286
D-4	CVD	21,326	25,590	D-15	Automatic Shibaura sputtering	6,524	7,828
D-5	SUMITOMOSEIMITU PECVD	15,350	18,420	D-16	Sputtering for ball	4,392	5,270
D-6	W-CVD	9,818	11,782	D-17	ALD	10,418	12,502
D-7	ANELVA sputtering equipment	8,588	10,306	D-18	High-temp. sputtering and O2 annealing	11,698	14,038
D-8	SHIBAURA sputtering equipment	3,758	4,510	D-20	ECR long-throw sputter	6,450	7,740
D-9	Electron beam evaporator	6,838	8,206	D-21	SPP Technologies TEOS PECVD	16,770	21,507
D-10	Sol-gel auto-deposition system	8,066	9,680
D-11	Plating equipment	2,534	3,040
E.Etching
E-1	DeepRIE #1	8,054	9,666	E-12	TMAH etching equipment	3,112	3,734
E-2	DeepRIE #2	8,054	9,666	E-13	DeepRIE #4	14,770	17,724
E-3	DeepRIE #3	8,278	9,934	E-14	Ion milling	11,360	13,632
E-4	ANELVA RIE equipment	7,078	8,494	E-15	Vapor HF etching	8,534	10,240
E-5	ANELVA Si RIE equipment	6,346	7,616	E-16	Ulvac ICP-RIE#1	15,970	19,166
E-6	Al-RIE	11,912	14,294	E-17	Chemical Dry Etcher (CDE)	5,976	7,172
E-7	ULVAC ashing equipment	4,066	4,880	E-18	Plasma cleaner	3,198	3,838
E-8	BRANSON ashing equipment	3,316	3,980	E-19	Ulvac ICP-RIE#2	15,684	18,820
E-10	ULVAC multi-purpose RIE equipment	10,902	13,082
E-11	KOH etching equipment	3,100	3,722
F.Bonding, polishing and packaging
F-1	Wafer bonding equipment	5,946	7,134	F-9	EVG wafer bonder	6,112	7,336
F-2	TOKYO SEIMITSU dicer	9,656	11,588	F-10	EVG aligner for wafer bonding	5,302	6,362
F-3	DISCO dicer	2,646	3,176	F-11	UV imprint	6,638	7,964
F-4	Wire bonder	1,186	1,424	F-12	Thermal imprint	5,900	7,080
F-5	Laser marker	2,436	2,922	F-13	Excimer lamp cleaner	2,700	3,240
F-6	6-inch wafer polishing equipment	2,120	2,544	F-14	Surface planer	14,974	17,968
F-7	4-inch wafer polishing equipment	1,822	2,186	F-15	Shibuya LAMICS AQL-1900	8,018	9,622
F-8	Sand blast	3,418	4,102
G.Measurement
G-1	Wafer dust detector	1,976	2,372	G-15	Ultrasonic microscope	2,284	2,742
Ｇ-2	Film thickness gage	1,384	1,662	G-16	Digital thermo microscope	1,248	1,496
G-3	Dektak step profiler	1,658	1,990	G-17	Infrared microscope	1,236	1,482
G-4	Tenchor step profiler	1,658	1,990	G-18	Quadrupole mass analyzer	1,226	1,472
G-5	Depth measuring equipment	1,074	1,290	G-20	Quick coater	1,338	1,606
G-6	4-probe measuring equipment	1,076	1,290	G-22	Desktop Ellipsometer	746	896
G-7	Spreading resistance profiler	2,616	3,140	G-24	Laser/white light conforcal microscope	4,728	5,674
G-8	Wafer prober	2,666	3,198	G-25	Line-focus-beam acoustic microscope for material characterization #1	3,488	4,184
G-9	Metal microscope	1,152	1,382	G-26	Line-focus-beam acoustic microscope for material characterization #2	3,488	4,184
G-10	Digital microscope	1,540	1,848	G-27	FIB	9,596	11,516
G-11	Thermal electron SEM	2,632	3,158	G-28	XRD	5,154	6,184
G-12	FE-SEM	4,622	5,546	G-29	JEOL FE-SEM	5,330	6,396
G-13	Micro X-ray CT	3,324	3,988
G-14	Ellipsometer	972	1,166

※Nanofabrication：All charges listed here are including tax.